-         MCM-D/C(Multi-chip module composed of deposited organic thin-film on ceramic substrate).

-         MCM-D/C technology is an extremely promising approach to achieve high wiring density, low dielectric constant, low dissipation factor, and high-flexural strength for high speed and high-frequency multi-chip module.

-         A new MCM-D/C substrate have been developed for high performance multi-chip module using the MGC substrate and CU/photo sensitive benzocyclobuten(BCB) thin-film technology.

-         Cu/BCB layer are composed with thin film technology and it possible to achieve very high wiring density on the glass ceramic substrate.

 

 

CERAMIC PACKAGE INVENTORY

 

 

Ceramic Side Braze / DIP

 

      Ceramic Pin Grid Array CGPA

 

     Ceramic Leaded Chip Carrier CQFJ 

 

   Ceramic Leadless Chip Carrier

  

 

 

     Ceramic Quad Flat Package / Cerquad CQFP

 

 

 

Ceramic SOIC