• From the view point of developing multiplayer substrate for high speed, multi chip modules and package, the following properties should be satisfied to achieve identical ceramic material:

1. Reduce the dielectric constant for the insulator material.
2. Use the low electrical resistivity conductor.
3. Match the silicon semiconductor chip with the terminal expansion(CTE).
4. Mechanical strength for the substrate should be tough enough.

o        To make this requirement, a few factor have been develop for advance and module. The point are:

1.      new glass-ceramic material

2.      new organic oscillator material

3.      new substrate structure