 |
| IC CERAMIC - Example of ceramic IC
|
|
|
~The Ball-Grid Array
- One of the most promising technologies, combining high performance, low cost, and reliability, is the Ball-Grid Array (BGA) package. Originally a solution for high-speed, high-pin-density digital ICs, BGA packaging has made its way into the high-frequency marketplace.
- BGAs are stretching the performance barriers to 30 GHz and beyond, and are facilitating the expansion of high-speed communications both for wireless and wireline applications.
- Construction of the standard BGA package is relatively simple (Figure 2).
|
Figure 2: The basic construction of a BGA package
|
|
Figure 3
|
|
|
|
The chip-bump array on a flip-chip BGA (FC-BGA) increases lead counts to more than 1500. Decreased chip-to-pc-board inductance results in faster chip-to-board signal speed.
|
|
| Today, there have been 1 visitors (2 hits) on this page!
|
|
|
