IC CERAMIC - Packages Come in Many Styles

A wide variety of packages are used for commercial wireless products—they can be divided into two broad categories:

1. Leaded IC packages

Leaded packages are inexpensive and widely used, offering low-to-moderate electrical performance for wireless IC applications.
However, most leaded packages have significant parasitic effects, limiting their performance in many applications.

2. Leadless IC packages

With the performance advantage of leadless packages, devices that operate above 6 GHz can now be assembled using standard high-volume manufacturing processes and integrated onto the same PCB as the IF and modem circuits.
This results in much lower packaging cost, higher reliability, and higher levels of integration.
Most leadless packages are constructed of ceramics, either high-temperature fired ceramics such as alumina, or low-temperature co-fired ceramic (LTCC). Because of the relatively high thermal resistance of this material, true SMT leadless ceramic packages have a moderate limitation on total-package power dissipation.

Alumina Package Sealing Glass
Alumina Package Sealing Glass is designed to provide the material with the best properties for sealing alumina ceramic packages.
Powder Glass for IC Packages (for Low-Expansion Ceramics)
These low temperature sealants are suitable for sealing AlN, Mullite and SiC.
Low Temperature Sealants for Display Devices
Composite and devitrifiable sealing glass is used for sealing display devices.
Granulated Glass for Metal Package
Granulated glass possesses free flow characteristics and excellent workability in the tablet-forming process.
Rectifier Molding Glass
This is available for low-voltage rectifier diodes and for high-voltage rectifier diodes.
Passivation Glass
Zinc-borosilicate passivation glass, lead silicate and lead borosilicate passivation glass are available.
Glass-Ceramics for Low Temperature Firing of Multilayer Substrates
It allows the use of highly conductive elements such as gold and silver paste as internal conductors to screen print circuit patterns.
It also allows the use of gold, silver alloy and copper paste as surface conductors.
Powder Glass for Coating and Binding
Powder glass is used to coat a wide variety of substrates and elements, and as a binder for thick film paste and ceramic chip devices.

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